AMD EPYC 7003 (3rd Gen) 7713 64-Core 2.0 GHz OEM Server Processor

The AMD EPYC 7003 family (3rd Gen) delivers unsurpassed enterprise performance for the most demanding data-center workloads. The AMD EPYC 7713, a tetrahexaconta-core processor with 64 cores and 128 threads, is engineered to maximize throughput in virtualization, big data analytics, databases, HPC simulations, and cloud-scale applications. Built on the Zen 3 architecture, this processor offers dramatic improvements in instruction per clock, cache efficiency, and memory bandwidth, enabling your servers to handle massive workloads with lower latency and higher efficiency. The OEM Pack is ideal for system integrators and OEMs who require a reliable, scalable CPU platform to power multi-socket servers, dense compute blades, and hyperscale environments. If you’re strategizing a modern upgrade to your data center, the 7713 provides a compelling combination of core density, frequency, and energy efficiency that translates into faster service delivery and better total cost of ownership.

With a base clock of 2.0 GHz and a robust boost profile, the 7713 is designed to balance sustained throughput with burst performance when workloads demand short-term acceleration. It supports an expansive PCIe 4.0 I/O fabric and multiple memory channels, delivering the bandwidth required for memory-intensive applications. The processor’s 7nm Zen 3 design brings improved cache utilization and unified memory access, reducing memory latency and enabling more concurrent tasks to proceed without stalling. For enterprise-grade reliability, the EPYC 7003 series also includes extensive security and virtualization features, making it a strong choice for private data centers, hosted services, and mission-critical deployments where uptime and predictability matter most.

• High-core-count performance for virtualization and multi-threaded workloads: 64 cores and 128 threads provide exceptional parallelism for VMs, containers, and analytics pipelines. This makes the 7713 well-suited for dense virtualized environments, large-scale databases, and parallel HPC tasks where throughput matters more than single-thread speed.
• Strong base and boost frequencies for responsive, real-world performance: With a 2.0 GHz base clock and competitive boost speeds, this CPU balances steady performance with bursts of higher frequency when workloads demand it, delivering faster query processing and smoother virtualized operations.
• Massive memory bandwidth with eight-channel DDR4 support: The processor supports high-capacity, tightly coupled memory configurations across eight channels, enabling memory-intensive applications to run with lower latency and higher throughput, even under concurrent access from many cores.
• Expansive I/O through PCIe 4.0: The AMD EPYC 7713 offers a dense PCIe 4.0 I/O fabric, providing ample lanes for storage controllers, networking adapters, accelerators, and GPU or AI accelerators, while preserving headroom for future upgrades.
• Energy efficiency and reliability for data-center workloads: The 7nm Zen 3 design emphasizes performance-per-watt, security features, and robust reliability mechanisms, supporting long-running workloads in enterprise environments with consistent performance and lower operating costs.

Technical Details of AMD EPYC 7003 (3rd Gen) 7713

• Core architecture: Zen 3 (7nm) with unified L3 cache design for improved data locality and processing efficiency.
• Core/Thread count: 64 cores / 128 threads.
• Base clock: 2.0 GHz.
• Max turbo frequency: Up to approximately 3.675 GHz (single-core turbo varies by SKU and cooling/board capabilities).
• Cache: Large L3 cache (typically 256 MB) to accelerate data reuse across cores and reduce memory latency for demanding workloads.
• Memory support: Eight-channel DDR4 memory, with support for DDR4-3200 ECC memory configurations to maximize bandwidth and data integrity.
• PCIe lanes: PCIe 4.0 support with a high lane count to enable fast NVMe storage, accelerators, networking, and GPUs in enterprise servers.
• Socket type: SP3 socket (LGA-style land grid array common to AMD EPYC 7003 processors).
• Thermal Design Power (TDP): Approximately 225W, depending on specific SKU, server platform, and cooling design.
• Memory capacity (typical per socket): Supports large memory configurations across eight channels, commonly up to several terabytes with appropriate DIMMs and platform support.
• Manufacturing process: 7nm silicon fabrication, optimized for performance and efficiency in dense data-center deployments.
• Security features: Includes AMD security features such as Secure Memory Encryption, virtualization enhancements, and platform reliability features designed to protect data and workloads in shared environments.
• Packaging: OEM Pack packaging optimized for system integrators and OEM deployments, with warranties and support aligned to enterprise server ecosystems.

how to install AMD EPYC 7003 (3rd Gen) 7713

• Power down the server, unplug the power cords, and ground yourself to prevent static discharge before handling the processor or motherboard.
• Verify motherboard compatibility and ensure the BIOS/UEFI is updated to a version that supports AMD EPYC 7003 processors for correct microcode and performance optimizations.
• Carefully unlock and open the SP3 socket on the motherboard, checking for any protective covers or alignment marks that indicate the correct seating orientation.
• Align the processor's notches or marked corner with the socket indicators, then gently place the CPU into the socket without applying excessive force. Secure the locking mechanism per the motherboard design.
• Apply a thin, even layer of high-quality thermal interface material (TIM) if the heatsink requires separate TIM, and attach the heatsink/fan assembly securely according to the platform's guidelines.
• Install the memory modules in accordance with the motherboard’s recommended channel configuration to maximize bandwidth. Power on the system and enter BIOS/UEFI to confirm CPU recognition, enable appropriate virtualization features if needed, and configure memory profiles.
• Run a basic post-test to verify CPU temperature and fan behavior, then proceed with operating system installation or orchestration software as part of your data-center deployment.
• Update system firmware and drivers as required, and monitor performance metrics to ensure the CPU operates within expected thermal and power envelopes under typical workloads.

Frequently asked questions

• Q: What workloads is the AMD EPYC 7713 best suited for? A: The 7713 excels in virtualization, large-scale databases, analytics, HPC workflows, AI inference at scale, and other multi-threaded data-center tasks where high core counts and memory bandwidth translate into faster processing and better throughput.
• Q: What is the primary benefit of the Zen 3 architecture in this processor? A: Zen 3 consolidates data and instructions more efficiently, reducing latency and increasing instructions-per-cycle performance, which improves overall throughput for multi-threaded workloads and improves single-thread responsiveness for broader workloads.
• Q: How much memory can I realistically expect to install per socket? A: With eight memory channels and DDR4-3200 ECC memory, you can build very large memory configurations; many enterprise deployments support multiple terabytes per socket depending on DIMM sizes and motherboard capabilities.
• Q: Is PCIe 4.0 supported for storage and accelerators? A: Yes, PCIe 4.0 provides higher bandwidth for NVMe storage, networking cards, GPUs, and accelerators, enabling faster data transfer and improved I/O performance for demanding workloads.
• Q: What is the recommended cooling and power approach for the 7713? A: Use server-grade cooling designed for 225W TDP, with adequate airflow and thermal monitoring. Ensure the power supply and motherboard power delivery meet the platform’s requirements to sustain peak performance without throttling.