AMD EPYC 9004 (4th Gen) 9254 24-Core 2.90 GHz Socket SP5 Processor

The AMD EPYC 9004 (4th Gen) 9254 is a powerhouse server processor designed for modern data centers that demand sustained multi-threaded performance, rock-solid reliability, and scalable compute for virtualization, databases, analytics, and HPC workloads. With 24 cores and 48 threads delivered across a robust 64-bit architecture, this tetracosa-core CPU sits at the heart of AMD’s premium enterprise platform. Built for headless operation and optimized to run in dense rack environments, the 9004 series is crafted to deliver predictable performance under heavy, mixed workloads while maintaining energy efficiency in large-scale deployments. The 9254 leverages Socket SP5 compatibility to fit the latest server motherboards and supports the high-bandwidth memory and PCIe configurations typical of modern data centers. Weighing in at a substantial 200 W TDP, this processor is intentionally designed for sustained throughput, making it an ideal option for cloud infrastructure, virtualization hosts, database clusters, AI inference nodes, and HPC clusters that require consistent, mission-critical performance over long operating windows.

• Massive multi-core performance for virtualization, databases, and data analytics. With 24 cores and 48 threads, the 9254 accelerates concurrent workloads, enhances consolidation density, and improves resource utilization across virtual machines, containers, and service-oriented architectures. The dense core count translates to higher thread-level parallelism, enabling faster query execution, smoother virtualization pipelines, and more responsive analytics pipelines under heavy departmental workloads.
• Large, hierarchical cache for data-intensive workloads. Featuring 128 MB of L3 cache combined with 24 MB of L2 cache, this EPYC processor minimizes memory latency and reduces cache misses during large-scale data processing. The result is faster data access for analytics queries, caching of frequently accessed datasets, and improved throughput in in-memory databases and real-time analytics tasks, even under heavy I/O pressure.
• Headless, graphics-free design with SP5 compatibility. The 9254 is built for server environments where discrete GPUs are unnecessary or undesirable. Its no-graphics configuration reduces power draw and thermal output in headless rack deployments, while the Socket SP5 platform provides a scalable foundation for enterprise servers, enabling efficient pairing with high-performance memory, accelerators, and storage configurations in modern data centers.
• Robust power and thermal design for sustained throughput. The 200 W thermal design power (TDP) supports sustained compute bursts while maintaining reliability under long-running workloads. Combined with AMD's architectural optimizations and supporting cooling strategies, this processor maintains stable clock speeds and reduces thermal throttling during peak demand, ensuring consistent performance for service-level agreements in enterprise environments.
• High clock flexibility and 64-bit processing for diverse workloads. Operating at a base frequency of 2.90 GHz with the potential to scale up to 4.15 GHz under load, the 9254 delivers burst performance when faced with demanding tasks such as query optimization, multi-tenant virtualization, or parallel HPC workloads. The 64-bit architecture enables modern software stacks, large address spaces, and efficient handling of large data sets, while preserving compatibility with existing software ecosystems in enterprise IT.

Technical Details of AMD EPYC 9004 (4th Gen) 9254

• Core count: 24 (Tetracosa-core)
• Thread count: 48
• Base clock: 2.90 GHz
• Max turbo/overclocking speed: Up to 4.15 GHz
• Cache (L2): 24 MB
• Cache (L3): 128 MB
• Socket: SP5
• Graphics: No integrated graphics
• Thermal Design Power (TDP): 200 W
• Architecture: 64-bit processing

How to install AMD EPYC 9004 (4th Gen) 9254

• Confirm motherboard compatibility with Socket SP5 and AMD EPYC 9004 processors. Check the motherboard’s CPU compatibility list and BIOS version requirements to ensure full support for 4th Gen AMD EPYC features and memory configurations.
• Prepare for installation with proper static precautions and a clean workspace. Ground yourself and handle the processor by its edges to avoid contact with pins or contacts. Ensure you have a compatible, high-performance server cooler capable of dissipating the 200 W TDP and providing reliable contact with the CPU heat spreader.
• Install the processor into the SP5 socket with correct orientation. Align the CPU’s notches or alignment markers with the socket’s keying features, seat the CPU evenly, and secure the socket latch or locking mechanism per the motherboard’s instructions to ensure proper mechanical and electrical contact.
• Apply an appropriate thermal interface material and mount a compatible heatsink or cooling solution. Given the 200 W TDP, choose a server-grade cooler with sufficient heat dissipation and airflow. Ensure the cooling solution is properly fastened and that there is no excessive pressure on the CPU, memory DIMMs, or motherboard components.
• Configure BIOS/UEFI settings and perform initial POST testing. Update the BIOS to the latest available firmware, enable essential features (such as ECC memory if supported by the platform, PCIe configurations, and power management options), and boot to the operating system installer or a diagnostic tool. Run standard post-assembly checks to confirm CPU detection, core counts, and readiness for memory initialization and OS boot.

Frequently asked questions

• Q: What is the socket type? A: Socket SP5.
• Q: How many cores and threads does the AMD EPYC 9004 9254 have? A: 24 cores and 48 threads.
• Q: What are the base and boosted clock speeds? A: Base clock is 2.90 GHz with up to 4.15 GHz possible under higher workloads (overclocking/turbo behavior depending on platform and cooling).
• Q: Does this processor include integrated graphics? A: No, it is a graphics-less (no integrated graphics) processor designed for headless server deployments.
• Q: What is the cache configuration? A: 24 MB L2 cache and 128 MB L3 cache to help reduce memory latency and increase data locality for data-intensive tasks.
• Q: What is the TDP? A: 200 W, designed for sustained throughput in data-center environments with adequate cooling and power provisioning.