HPE Intel Xeon Gold (3rd Gen) 6330 Octacosa-core Upgrade

Upgrade your server with the HPE Intel Xeon Gold 6330 (3rd Gen) Octacosa-core processor and unlock unparalleled multi-threaded performance for enterprise workloads. This 28-core, 56-thread powerhouse is engineered for dense virtualization, large-scale databases, data analytics, and demanding compute tasks. Built on a 10‑nm process and designed for modern server ecosystems, the Xeon Gold 6330 delivers robust 64-bit processing, expansive cache, and reliable performance per watt that data centers rely on for consistent, long-term operation. With a base clock of 2.0 GHz and a turbo capability up to 3.10 GHz, this upgrade is compatible with the LGA‑4189 socket, enabling seamless integration into HP/HPE servers that require high-core-count capability without soldering. Whether you’re expanding capacity, modernizing your virtualization cluster, or accelerating mission-critical workloads, the Xeon Gold 6330 is engineered to help you achieve faster results with enterprise-grade reliability.

• Massive multi-threaded performance: 28 cores and 56 threads empower virtualization, large databases, real-time analytics, and AI-serving workloads with exceptional parallel processing capacity.
• High-speed turbo for burst workloads: Base frequency of 2.0 GHz with up to 3.10 GHz turbo frequency enables responsive performance during peak demand while maintaining core efficiency for steady-state tasks.
• Efficient 10 nm architecture: The 10‑nm process delivers enhanced performance-per-watt, helping to control operating costs in dense data-center environments and improving thermal headroom for sustained workloads.
• Generous 42 MB L3 cache: A large, fast cache reduces data access latency and improves throughput for large-scale applications, virtualization layers, and memory-intensive operations.
• Solid platform compatibility: Designed for the LGA-4189 socket, this upgrade is tailored for HP/HPE server ecosystems, enabling a straightforward upgrade path without soldering and with 64-bit processing supported for modern software stacks.

Technical Details of HPE Intel Xeon Gold (3rd Gen) 6330

• Processor family: Intel Xeon Gold (3rd Gen) 6330
• Cores / Threads: 28 / 56
• Base frequency: 2.00 GHz
• Max turbo frequency: 3.10 GHz
• Cache: 42 MB L3
• Process technology: 10 nm
• Socket type: LGA-4189
• TDP: 205 W
• 64-bit processing
• Designed for server-grade workloads and HP/HPE systems

How to install HPE Intel Xeon Gold (3rd Gen) 6330

Installing this processor upgrade requires careful handling, proper tooling, and compatibility verification with your HP/HPE server platform. Follow these steps to ensure a safe, reliable installation and optimal performance:

1. Verify compatibility: Confirm your motherboard supports the LGA-4189 socket and that the system BIOS is compatible with the Xeon Gold 6330. Check the HP/HPE server service documentation or BIOS release notes for processor support and microcode updates.
2. Power down and prepare: Shut down the server, unplug from power, and disconnect all external cables. Ground yourself to avoid static discharge before handling components.
3. Access the CPU socket: Remove the server chassis cover or access panel per the vendor’s servicing guide. Locate the LGA-4189 socket and the cooling assembly.
4. Remove old processor (if upgrading): If replacing an existing CPU, unlock the CPU socket lever, carefully lift out the old processor, and clean any old thermal interface material from the heatsink surface and socket area.
5. Install the new processor: Align the Xeon Gold 6330 with the socket notches and pin-1 indicator. Gently seat the processor into the socket and secure the locking lever. Ensure there is no misalignment to avoid bent pins or damage.
6. Apply thermal interface material and reinstall cooling: Apply a thin, even layer of thermal paste (or use the server’s official thermal interface material) and mount the heatsink or CPU cooler securely. Reconnect any cooling fans or brackets as required by the system design.
7. BIOS and firmware updates: Reassemble the server, reconnect power, and boot into the BIOS. If prompted, apply recommended microcode updates or BIOS settings for CPU enablement, memory interleaving (if applicable), and power/thermal policies. Save changes and boot into the operating system.
8. Validation and monitoring: Run POST diagnostics, verify CPU recognition in the OS, and monitor core temperatures and turbo behavior under representative workloads to ensure stable operation and cooling headroom.

Frequently asked questions

• Q: What is the core count and thread count of the HPE Xeon Gold 6330?
  A: It features 28 cores and 56 threads, delivering strong multi-threaded performance for virtualization, databases, analytics, and HPC tasks.
• Q: What socket does this processor use?
  A: The Xeon Gold 6330 uses the LGA-4189 socket, designed for modern server platforms and HP/HPE servers requiring this interface.
• Q: What is the base and turbo frequency?
  A: The base frequency is 2.00 GHz, with a maximum turbo frequency of up to 3.10 GHz, enabling bursts for demanding workloads while maintaining efficiency during steady-state operation.
• Q: How much cache does it have?
  A: It includes 42 MB of L3 cache, which helps accelerate large data sets and improves overall throughput for data-intensive applications.
• Q: What is the power requirement?
  A: The processor has a Thermal Design Power (TDP) of 205 W, so ensure adequate cooling and power provisioning in your HP/HPE server environment.
• Q: Is overclocking supported on this Xeon Gold processor?
  A: Xeon Gold processors are typically used in enterprise/server environments where overclocking is not standard. The stated turbo frequency (3.10 GHz) reflects boost performance available under appropriate cooling and platform conditions, not a manual overclocking feature.
• Q: Is this a direct upgrade for HP/HPE servers?
  A: Yes, when paired with a compatible motherboard and BIOS, this processor is designed for HP/HPE server ecosystems as a high-core-count upgrade option, enabling enhanced compute density without soldering.