HPE ML350 GEN11 STND Heat Sink Kit

The HPE ML350 GEN11 STND Heat Sink Kit is a purpose-built cooling solution engineered to maximize performance and reliability in HP’s latest ML350 Gen11 standard-height servers. This high-efficiency heat sink kit is designed to optimize thermal transfer, reduce CPU junction temperatures under heavy workloads, and support sustained turbo performance. By upgrading the primary heat-dissipation path, it helps lower overall server fan duty, minimize thermal throttling, and extend component life in demanding data center environments. Whether you’re deploying virtualized workloads, databases, AI-assisted analytics, or other compute-intensive applications, this kit delivers the robust cooling that modern enterprise servers require without compromising compatibility or serviceability. The result is improved uptime, greater processor headroom, and a quieter, cooler data center footprint, all while preserving the integrity of your HPE ML350 Gen11 platform.

• The kit provides a robust, multi‑fin aluminum heat sink design that increases surface area for superior heat transfer and efficient airflow within the ML350 Gen11 STND chassis.
• Engineered for Gen11 architecture, it supports higher sustained performance by maintaining lower CPU temperatures during demanding workloads, reducing thermal throttling and preserving peak clock speeds longer.
• Quiet operation is enhanced through improved thermal management, enabling reduced fan activity and lower acoustic output in data centers, offices, or remote locations where noise matters.
• Designed for straightforward installation with pre‑aligned components and included mounting hardware, ensuring a precise fit in standard-height ML350 Gen11 servers with minimal downtime.
• Built for durability and reliability, the heat sink kit uses corrosion-resistant finishes and stable materials to withstand data center conditions and deliver consistent thermal performance over time.

Technical Details of HPE ML350 GEN11 STND Heat Sink Kit

• Compatibility: HPE ML350 GEN11 STND server configurations (standard height)
• Product type: CPU heat sink kit for enhanced cooling
• Material: High-grade aluminum alloy with protective finish
• Finish: Silver anodized surface for durability and corrosion resistance
• Weight: Varies by revision; designed to balance heat dissipation with chassis payload
• Dimensions: Engineered to fit standard ML350 Gen11 socket spacing and 2U chassis form factor
• Includes: Heat sink assembly and mounting hardware required for installation

How to install HPE ML350 GEN11 STND Heat Sink Kit

Before you begin, power down the server, unplug all cables, and discharge static electricity. Follow these steps to ensure a clean, secure installation that maintains system integrity:

Step 1: Prepare the workspace. Clear a static-free area with proper tools and a clean surface. Remove any existing components obstructing access to the CPU area and verify the server is fully powered offline and disconnected from power sources.

Step 2: Access the CPU area. Remove the top cover or access panel as required by the ML350 Gen11 chassis to expose the CPU socket and existing cooling assembly.

Step 3: Remove the existing heat sink (if applicable). If thermal paste or pads are present, carefully clean the CPU contact surface with isopropyl alcohol and a lint-free cloth until the surface is pristine and free of residue.

Step 4: Align the new heat sink kit. Position the heat sink so that the mounting holes line up with the motherboard or retention brackets. Confirm that the fin orientation and air-flow path align with the chassis airflow to maximize cooling efficiency.

Step 5: Secure the heat sink. Attach the mounting hardware in a cross-pattern (if provided) to apply even pressure across the CPU surface. Use a torque-limiting tool if specified in the installation guide to avoid over-tightening while ensuring solid contact.

Step 6: Apply thermal interface material (if required). If the kit requires additional TIM, apply a thin, even layer according to the manufacturer’s guidance to promote optimal thermal conductivity between the CPU and heat sink base.

Step 7: Reassemble and power test. Reinstall any components removed during disassembly, reattach the chassis cover, reconnect cables, and power on. Enter the system diagnostics to confirm stable CPU temperatures, fan behavior, and correct sensor readings. If needed, update BIOS/firmware settings to recognize the new cooling component.

Step 8: Monitor performance. Run representative workloads while monitoring temperature, voltage, and fan activity. If temperatures remain elevated, verify seating, mounting torque, and thermal paste application, then recheck BIOS/firmware for any cooling configuration options.

Frequently asked questions

• Q: Is this heat sink kit compatible with all ML350 Gen11 configurations?
  A: The kit is designed for ML350 Gen11 standard-height (STND) configurations. For other form factors or specialized builds, verify compatibility with HPE support or product documentation before purchasing.
• Q: Will installing this heat sink void my server warranty?
  A: In most cases, replacing a heat sink within approved configurations does not void warranty. However, always review HP’s warranty terms or contact HP support to confirm coverage for your exact model and region.
• Q: Does this kit include thermal paste or pads?
  A: Many heat sink kits include appropriate thermal interface materials. If your kit does not include TIM, obtain a recommended product from the manufacturer and apply according to the provided instructions.
• Q: What performance improvements can I expect?
  A: Expect lower CPU junction temperatures under sustained load, improved stability during heavy workloads, and potential reductions in fan noise due to more efficient heat removal and better thermal management.