Lenovo Intel Xeon Platinum (3rd Gen) 8352M Dotriaconta-core (32 Core) 2.30 GHz Processor Upgrade

This Lenovo processor upgrade is engineered to push enterprise performance to new heights. Built on Intel’s 3rd Generation Xeon Platinum architecture, the 8352M Dotriaconta-core delivers exceptional multi-threaded throughput, expansive cache, and robust reliability for data centers, virtualization clusters, AI workloads, and memory-intensive applications. With 32 cores and 64 threads, a 48 MB L3 cache, and a base frequency of 2.30 GHz with the potential to reach higher clock speeds under load, this upgrade is designed to maximize compute density while maintaining efficient power and thermal performance in Lenovo server environments. The 10 nm process technology enhances efficiency and performance-per-watt, helping your workloads run smoother, faster, and more predictably in demanding enterprise settings. This upgrade is tailored for servers that require scalable performance, reliable operation, and a future-proof path for expanding computing capacity within Lenovo’s platform ecosystem.

• 32-core multi-threaded performance for parallel workloads: Tackle virtualization, enterprise databases, large-scale analytics, and AI inference with a processor designed to handle dozens of simultaneous threads without sacrificing responsiveness.
• Robust cache and memory efficiency: 48 MB of L3 cache reduces memory bottlenecks, speeding up data access for memory-intensive tasks and delivering consistent performance under heavy workloads.
• High clock flexibility for bursts of activity: 2.30 GHz base frequency with turbo-like acceleration up to 3.50 GHz when workloads demand peak performance, enabling quicker completion of demanding tasks and smoother short-duration spikes.
• Advanced silicon and process technology: Built on a 10 nm process that balances power efficiency with raw throughput, helping to lower total cost of ownership in dense data-center environments while preserving performance headroom.
• Enterprise-ready platform compatibility: Socket LGA-4189 compatibility ensures a streamlined upgrade path on qualifying Lenovo servers, reducing downtime and preserving the investment in your existing motherboard and chassis ecosystem.

Technical Details of Lenovo Intel Xeon Platinum (3rd Gen) 8352M Dotriaconta-core (32 Core) 2.30 GHz Processor Upgrade

• CPU Model: Intel Xeon Platinum 3rd Gen 8352M
• Core count: 32 cores, 64 threads
• Base frequency: 2.30 GHz
• Max turbo frequency: 3.50 GHz
• Cache: 48 MB L3
• Process technology: 10 nm
• Socket: LGA-4189
• Power (TDP): 185 W
• 64-bit processing
• Upgrade type: Processor upgrade for Lenovo servers
• Packaging: OEM-qualified for Lenovo server platforms

How to install Lenovo Intel Xeon Platinum (3rd Gen) 8352M Dotriaconta-core (32 Core) 2.30 GHz Processor Upgrade

Installing this processor upgrade requires careful handling and adherence to server maintenance procedures. Before you begin, verify motherboard compatibility, BIOS/firmware support, and cooling capacity. The LGA-4189 socket is designed for Lenovo servers that support Intel Xeon Platinum 3rd Gen CPUs, and installing an unsupported SKU can result in system instability or failure to POST. Follow these install guidelines to ensure a safe, reliable upgrade process:

• Power down the server completely and disconnect it from any power source. Ground yourself to avoid electrostatic discharge, and remove any components following Lenovo’s service manuals.
• Open the server chassis and locate the CPU socket area. If you are removing an existing processor, carefully unlock the socket lever and detach the old CPU according to your server model’s instructions. If you are installing into a fresh socket, verify that the socket alignment and thermals are prepared for a new processor.
• Align the 8352M with the socket notches and gently place it into the LGA-4189 socket. Do not apply excessive force; the processor should seat with even, light pressure. Close the socket lever to secure the CPU in place.
• Apply an appropriate thermal interface material or thermal paste and reinstall the server’s CPU cooler or heatsink according to Lenovo’s cooling guidelines. Ensure that cooling is sufficient to handle the 185 W TDP under sustained workloads, and verify that fans and heatsinks are properly mounted.
• Reconnect power, power on the server, and enter the BIOS/UEFI setup. Update to the latest BIOS revision if required to recognize the new CPU. Run a hardware integrity and stress test to confirm correct core detection, turbo behavior, and thermal performance. Monitor CPU temperatures under load and adjust cooling as needed.

Frequently asked questions

• Q: Is this processor compatible with all Lenovo servers? A: Compatibility depends on the specific Lenovo server model, the motherboard’s support for Intel Xeon Platinum 3rd Gen CPUs, and the BIOS version. Check your model’s hardware compatibility list or contact Lenovo support to confirm socket and BIOS requirements before purchasing.
• Q: What kind of performance can I expect? A: The 32-core, 64-thread design delivers substantial multi-threaded throughput, with a 48 MB L3 cache and turbo capability up to 3.50 GHz. Real-world gains depend on your workload mix, memory bandwidth, and cooling efficiency in your server environment.
• Q: Does this processor come with a cooler? A: No. Enterprise CPU upgrades generally do not include a cooler. Ensure your server has an appropriate air or liquid cooling solution capable of handling the 185 W TDP.
• Q: Can I overclock this CPU? A: In enterprise server environments, overclocking is typically not the primary feature. The 3.50 GHz figure denotes maximum turbo frequency under favorable conditions. Actual turbo speeds depend on workload, cooling, and motherboard firmware; always follow Lenovo’s guidelines and avoid unsafe overclocking practices.
• Q: How do I verify the upgrade post-install? A: After BIOS update, confirm CPU recognition, core count, and turbo states via the system BIOS and operating system utility tools. Run stability and stress tests, monitor temperatures, and ensure that the system remains within safe power and thermal envelopes.