Supermicro 2U Active CPU Heat Sink Socket LGA3647-0 (SNK-P0068AP4)

Engineered for high-density 2U and larger server deployments, the Supermicro SNK-P0068AP4 Active CPU Heat Sink delivers exceptional cooling performance for Intel Xeon scalable processors. This heat sink is purpose-built for the Supermicro X11DPL-i motherboard and other 2U+ chassis configurations that utilize the LGA3647-0 socket, ensuring reliable operation in demanding data-center environments. Fully tested and validated by Supermicro, it combines durability, precise thermal management, and a robust cooling solution designed to sustain peak processor performance under heavy workloads. The integrated active cooling design provides high airflow to keep CPUs cooler, reduce thermal throttling, and promote longer component life in dense rack configurations. Whether you’re building a high-performance compute node or expanding a data center’s capabilities, this heat sink is engineered to deliver consistent temperatures and dependable operation across generations of Xeon scalable processors.

• Optimized cooling for 2U and above systems: The SNK-P0068AP4 features an active cooling design with a high-flow fan assembly that efficiently draws cooling air through a finely engineered fin stack. This setup rapidly removes heat from the CPU package, helping to maintain stable core frequencies under sustained load and reducing the risk of thermal throttling in dense 2U racks. By maximizing airflow and minimizing thermal hotspots, it supports consistent performance for workloads such as virtualization, database processing, and scientific computing where processor temperature management is critical.
• Broad compatibility with LGA3647-0 Xeon platforms: Built to support Intel Xeon Scalable processors, this heat sink is designed for use with LGA3647-0 sockets and is suitable for Supermicro X11DPL-i motherboards as well as other compatible 2U+ systems. The mounting interface and retention mechanism are engineered for secure installation in high-vibration environments, delivering reliable contact between the processor and cooling path for steady heat transfer.
• Active cooling with high airflow: The integrated active fan module drives strong airflow across the base and through the fin array, enabling effective heat removal even as workloads push CPU utilization. This design helps maintain lower CPU temperatures during multiprocessor workloads and multi-threaded tasks, improving overall system stability and reducing thermal noise compared with passive or under-tized cooling solutions.
• Easy integration and maintenance: The heat sink is designed for straightforward installation into 2U and larger chassis with standard mounting hardware. Its compact footprint fits within typical rack configurations without compromising other components, and its modular design simplifies replacement or upgrades. This makes maintenance windows shorter and server uptime higher in environments where rapid serviceability is essential.
• Quality assurance and performance validation: Fully tested and validated by Supermicro to ensure the best quality and cooling performance. This rigorous QA process helps ensure reliable operation, predictable thermal performance, and compatibility across supported systems, giving data-center operators confidence in long-term reliability and service life for their Xeon-based servers.

Technical Details of Supermicro 2U Active CPU Heat Sink Socket LGA3647-0 (SNK-P0068AP4)

• Socket compatibility: LGA3647-0
• Processor family: Intel Xeon Scalable processors
• Form factor: 2U rack-mountable CPU heat sink
• Chassis compatibility: 2U and above systems
• Brand and validation: Fully tested and validated by Supermicro
• Primary design goal: High airflow active cooling to sustain performance under load

how to install Supermicro 2U Active CPU Heat Sink Socket LGA3647-0 (SNK-P0068AP4)

• Power down the server, unplug all power sources, and remove peripheral cables. Ensure the system is fully de-energized before touching internal components.
• Open the chassis and locate the target CPU socket (LGA3647-0) on the motherboard. If an existing heatsink is present, carefully detach it following your server documentation and clean the CPU surface to remove old thermal interface material.
• Inspect the mounting hardware included with the SNK-P0068AP4. Align the heat sink base with the CPU socket and positions for optimal contact. Attach the mounting brackets securely using the provided screws or retention hardware, ensuring even pressure across the socket for reliable cooling contact.
• Connect the integrated active fan power lead to the appropriate fan or system power header as specified by your motherboard or server chassis. Verify that the fan’s airflow direction is aligned to push air through the heatsink and away from the CPU, as intended by the design.
• Reassemble the server, re-connect cables, and power up the system. Monitor CPU temperatures under idle and load conditions to confirm proper installation and cooling performance. If temperatures remain elevated, re-check mounting torque, air flow direction, and any obstructions in the chassis that could impede airflow.

Frequently asked questions

• Q: What socket does the SNK-P0068AP4 support?
  A: It supports the LGA3647-0 socket used by Intel Xeon Scalable processors.
• Q: Is this heat sink compatible with 2U servers?
  A: Yes. It is designed for 2U and larger chassis and is intended for use with compatible Supermicro motherboards such as X11DPL-i and similar platforms.
• Q: Does the heat sink include the mounting hardware?
  A: Yes. The package includes the necessary mounting hardware and connectors for secure installation within 2U+ systems.
• Q: Does it require additional fans?
  A: The SNK-P0068AP4 features an integrated active cooling fan module. In most deployments, no additional fan assembly is required beyond standard server cooling infrastructure, though you should connect the fan to the appropriate power/header as directed by your board.
• Q: Has this heat sink been tested for reliability?
  A: Yes. It has been fully tested and validated by Supermicro to ensure quality, cooling performance, and compatibility with supported Xeon platforms.