Tyan B7015F72V2R Barebone System – 4U Rack-Mount Dual-Processor Ready

The Tyan B7015F72V2R represents a premium barebone foundation engineered for enterprise-grade performance in dense data center environments. Built to maximize compute density, this 4U rack-mountable chassis supports two processors and is driven by the Intel 5520 chipset, delivering robust multi-core performance and scalable memory capabilities essential for virtualization, HPC, and large-scale applications. Designed for professional deployments, it offers a flexible, modular platform that can be configured to meet demanding workloads while fitting neatly into standard data-center racks. If you’re building a private cloud, consolidating workloads, or deploying a compute-intensive cluster, the B7015F72V2R provides the reliability, expandability, and control you require.

With its substantial memory footprint and thoughtful I/O options, this barebone system is tailored to handle memory-hungry workloads and bandwidth-intensive tasks. It supports up to 144 GB of DDR3 SDRAM across 18 memory slots, enabling you to configure generous memory pools for in-memory analytics, large-scale virtualization, and multi-tenant environments. The platform is designed to balance memory capacity with processor performance, helping you scale compute resources as demands evolve. Storage is addressed through a Serial ATA/300 controller and two 2.5" drive bays, giving you flexible options for operating systems, databases, and persistent data. Coupled with ASPEED AST2050 graphics for efficient headless management and a standard RJ-45 network interface, this barebone is ready for rapid deployment and remote administration in professional settings.

• High-Density 4U Rack-Mount Design: The B7015F72V2R is purpose-built for enterprise racks, delivering a compact yet powerful chassis that accommodates dual processors and extensive memory while maximizing floor space in data centers, labs, and HPC clusters. This design supports dense consolidation without sacrificing performance, making it ideal for virtualization hosts, compute nodes, and power-efficient server farms.
• Dual-Processor Capability with LGA-1366 Socket B: Equipped to host two processors on Socket B LGA-1366 platforms enabled by the Intel 5520 chipset, this barebone delivers strong multiprocessing capability and threading support. With two CPUs, you gain higher parallelism, improved virtualization density, and the headroom needed for demanding workloads such as database services, large-scale simulations, and multi-VM environments.
• Massive Memory Capacity and Expandability: Up to 144 GB of DDR3 SDRAM across 18 slots, compatible with DDR3-1333/PC3-10600 modules. This generous memory footprint supports memory-intensive workloads, real-time analytics, and virtualized environments where large working datasets reside in memory, enabling faster data access and improved application responsiveness.
• Storage, I/O, and Management Readiness: Features two 2.5" drive bays and a Serial ATA/300 controller to accommodate OS and data drives with flexible expansion options. The integrated ASPEED AST2050 graphics engine provides reliable management capabilities for headless operation, while the standard RJ-45 network interface ensures solid connectivity for remote administration, monitoring, and networked deployments.
• Designed for Enterprise Deployments: This barebone chassis is built for reliability, scalability, and performance in enterprise scenarios. It serves as a solid foundation for virtualization hosts, private clouds, HPC nodes, and compute clusters, offering a robust platform that can be tuned to meet specific reliability, performance, and budget requirements.

Technical Details of Tyan B7015F72V2R

• Form Factor: 4U Rack-mountable
• Processor Support: 2 x Intel Xeon / Socket B LGA-1366 (Intel 5520 chipset)
• Memory: 144 GB DDR3 SDRAM, DDR3-1333/PC3-10600, 18 total memory slots
• Storage: Serial ATA/300 Controller; 2 x 2.5" bays
• Graphics: ASPEED AST2050
• Network: RJ-45 Ethernet
• Other: Barebone system (chassis, motherboard, power supply); designed for high-density compute and scalable configurations

How to install Tyan B7015F72V2R

• Preparation: Confirm compatibility of processors (LGA-1366), DDR3 memory, and any storage you plan to install. Ensure you have a compatible 4-post rack, appropriate power capacity, and a plan for cooling and cable management in your data center environment.
• Install Processors: Open the processor sockets on the motherboard, apply the correct thermal interface material, seat the CPUs securely, and install the appropriate heatsinks. Follow the motherboard’s documentation for proper orientation and mounting to ensure reliable heat dissipation in a 4U chassis.
• Install Memory Modules: Insert DDR3 RAM into the 18 memory slots according to your memory topology and the motherboard guidelines. Populate channels to achieve balanced performance and maximize the available memory bandwidth for your workloads.
• Install Storage: Place your 2.5" drives into the bays, connect the drives to the Serial ATA/300 controller with the appropriate data and power cables, and secure any drive cages or backplanes as required by the chassis design.
• Power-Up and Configuration: Mount the barebone in a compatible rack, connect power and network cables, and boot into the system BIOS. Configure memory timings, CPU preferences, boot order, RAID or storage settings, and any remote management features to align with your deployment plan.

Frequently asked questions

• Q: What does the Tyan B7015F72V2R require to operate? A: This is a barebone system designed to be completed with your own CPUs, memory, and storage. It provides a 4U rack-mount chassis, dual-processor capability, Intel 5520 chipset, and essential I/O. Install your own components to complete the build.
• Q: How much memory can I install? A: Up to 144 GB DDR3 SDRAM across 18 slots (DDR3-1333/PC3-10600).
• Q: How many drives can I install? A: It includes two 2.5" drive bays for storage and a Serial ATA/300 controller for additional options; further drives can be added via backplanes or compatible chassis configurations.
• Q: Does it include integrated graphics? A: The system uses ASPEED AST2050 graphics for management tasks in headless operation; advanced graphics workloads would require a separate GPU configuration if supported by the motherboard and chassis.
• Q: Is this suitable for virtualization? A: Yes. With dual processors, a large memory footprint, and a 4U chassis, it is well-suited for virtualization, private cloud, and dense compute workloads when configured appropriately for your environment.