Tyan S7002GM2NR-LE Server Motherboard – Intel 5500 Chipset, Socket B LGA-1366

Designed for enterprise-grade servers, the TYAN S7002GM2NR-LE is a high-performance, dual-socket motherboard built around the Intel 5500 chipset. This SSI CEB board is engineered to maximize computational throughput, memory bandwidth, and IO scalability, delivering a reliable platform for virtualization, databases, and mission-critical workloads. It supports up to two Intel Xeon 5500 Series processors and up to 64GB of DDR3 memory at speeds of 800/1066/1333 MHz, providing a flexible foundation for modern data center applications. With a focus on scalable 32- and 64-bit computing environments, the S7002GM2NR-LE is designed to meet the demanding requirements of virtualization, large-scale analytics, and enterprise deployments while maintaining compatibility with a broad ecosystem of enterprise components.

• Dual-processor architecture for scalable performance: The S7002GM2NR-LE is built to accommodate up to two Intel Xeon 5500 Series processors, enabling robust parallel processing for virtualization, databases, ERP systems, and other compute-intensive workloads. This dual-socket design allows you to consolidate workloads that previously required multiple servers, improving efficiency, reducing latency, and driving better resource utilization across your data center.
• High-capacity memory support for demanding workloads: With support for up to 64GB of DDR3 memory at 800/1066/1333 MHz, this motherboard delivers substantial memory bandwidth across multiple channels. This makes it well-suited for in-memory databases, virtualization hosts with many virtual machines, and data analytics workloads that benefit from large caches and fast data access.
• Intel 5500 chipset and scalable platform: Leveraging the Intel 5500 Series chipset, the S7002GM2NR-LE provides a scalable computing environment capable of handling modern enterprise workloads. The platform is optimized for virtualization and data-intensive tasks, offering improved IO throughput and compatibility with a broad ecosystem of enterprise storage, networking, and expansion options.
• Enterprise-grade form factor for easy integration: The board utilizes the SSI CEB form factor, designed to fit standard enterprise chassis and backplanes. Its layout promotes straightforward deployment in data centers, server rooms, and colocation facilities, with clearly labeled headers and connector placements that simplify maintenance and serviceability over the life of the server.
• Flexible expansion and reliability for uptime: The S7002GM2NR-LE provides ample expansion opportunities for PCIe adapters and storage interfaces, enabling you to tailor the server to your workload. Built with server-grade design principles, it emphasizes reliability, robust power delivery, and compatibility with enterprise firmware and management tools to help minimize downtime and streamline administration.

Technical Details of Tyan S7002GM2NR-LE

• CPU support: Up to two Intel Xeon 5500 Series processors in a dual-LGA1366 configuration.
• Socket: Socket B LGA-1366.
• Chipset: Intel 5500 Series chipset.
• Memory: DDR3 memory, up to 64GB total capacity, with support for 800/1066/1333 MHz modules.
• Form factor: SSI CEB (Server System Infrastructure — Common Entry Board) compliant.

How to install Tyan S7002GM2NR-LE

• Step 1: Prepare a compatible chassis and power supply. Ensure the chassis provides adequate airflow and that the power supply meets the board and CPU requirements for steady operation under load.
• Step 2: Install the cooling solution. Insert the dual LGA-1366 CPUs into their sockets, secure the locking mechanisms, and apply appropriate thermal interface material as recommended by the cooler manufacturer.
• Step 3: Populate memory modules. Install DDR3 DIMMs according to the CPU configuration and vendor guidelines to maximize memory bandwidth and stability. Verify that memory ranks and channels align with the processor’s capabilities for best performance.
• Step 4: Mount the motherboard in the chassis. Align standoff positions, secure the board with screws, and connect the 24-pin ATX power connector and the 8-pin CPU power connectors, along with any additional power rails required by your backplane or storage backplane.
• Step 5: Connect storage and expansion components. Attach SATA/SAS backplanes or drives, install PCIe cards as needed, and hook up data and power cables for storage and I/O devices. Ensure that any backplane connections match the motherboard’s layout for reliable hot-swap or RAID configurations.
• Step 6: Power on and configure BIOS/UEFI. Enter the firmware setup to configure CPU operating modes, memory timing, boot sequence, and virtualization-related features. Install or update firmware and drivers as needed to ensure full compatibility with your operating system and management tools.

Frequently asked questions

• What processors does the TYAN S7002GM2NR-LE support? It supports up to two Intel Xeon 5500 Series processors in a dual-LGA1366 configuration, enabling high-end multi-threaded performance for server workloads.
• How much memory can it support? It supports up to 64GB of DDR3 memory at speeds of 800/1066/1333 MHz, depending on the CPU configuration and memory population.
• What form factor is this board? It uses the SSI CEB form factor, designed for enterprise chassis and backplanes with standard mounting and connectivity layouts.
• What are the key platform features? The board leverages the Intel 5500 Series chipset to deliver scalable computing, solid IO throughput, and virtualization-friendly capabilities suitable for data centers and virtualization hosts.
• Is this board suitable for virtualization and database workloads? Yes. With dual Xeon support and ample DDR3 memory, it is well-suited for virtualization hosts, large databases, and other data-intensive workloads common in enterprise environments.
• What installation considerations should I keep in mind? Ensure proper airflow, follow chassis and cooler mounting guidelines, and keep firmware and drivers up to date to maximize stability and performance.